The main purpose of the SMT chip processing is to accurately mount the surface-mount components to the PCB, and sometimes there are some process problems in the process of chip-mounting that affect the quality of the chip, such as the displacement of components. The displacement of the components that appear in the chip processing is a fork in the process of the component plate in the welding process, which needs attention. What are the reasons for the shifting of components in chip processing? The following hundreds of thousands of chip processing manufacturers will introduce analysis for everyone.


Reasons for component shift in patch processing:


1. The use time of solder paste is limited. After the service life is exceeded, the flux is deteriorated and the soldering is poor.


2. The stickiness of the solder paste itself is not enough, and components and parts are displaced due to oscillations, shaking, etc. during handling.


3. The flux content in the solder paste is too high. Excessive flux flow during the reflow process causes displacement of the components.


4, components in the printing, patch handling process due to vibration or improper handling of the components caused displacement.


5, patch processing, the nozzle pressure is not adjusted, the pressure is not enough, causing the components to shift.


6. The mechanical problem of the mounter itself has caused the placement of the components to be incorrect.




The component shifting in the chip processing will affect the performance of the circuit board. Therefore, it is necessary to understand the causes of component shift during the processing and to solve the problem.

Next:Electronic Device Sales