SMT chip processing began to become more and more known in today's electronic product boom, SMT chip processing process has attracted a lot of friends with strong curiosity, today, the state of Penguin Xiaobian will be detailed in this article Exemplify the entire process of SMT chip processing and hope to help you.


1.Single-side assembly: incoming material inspection + screen printing + solder paste (red glue) + patch + reflow (curing) + cleaning + detection + rework


2.Single-side mixing: incoming material inspection + PCB side A silk screen printing paste (red glue) + patch + A surface reflow (curing) + cleaning + plug-in + crest + cleaning + detection + rework


3. Double-sided assembly: incoming material detection + PCB A surface silk screen solder paste (red plastic) + patch + A surface reflow (curing) + cleaning + flap + B surface silk screen printing paste (red plastic) + patch + B Surface Reflow (Cure) or (DIP+Crest) + Cleaning + Detection + Rework


4. Double-side mixing: incoming material inspection + PCB B side screen printing paste (red glue) + patch + B surface reflow (curing) + cleaning + flap + A surface silk screen printing paste (red glue) + patch +B Reflow (Cure) or (DIP+Crest) + Cleaning + Detection + Rework


5. Silk screen printing: Its function is to print the solder paste or patch glue onto the PCB's pad to prepare for the welding of the components. The equipment used is a screen printer (screen printer) located at the forefront of the SMT production line.


6. Dispensing: It is a fixed position where the glue drops onto the PCB. Its main function is to fix the components to the PCB. The equipment used is a dispenser, located at the front of the SMT production line or behind the inspection equipment.


7. Mounting: Its role is to accurately install surface mount components to the PCB's fixed position. The equipment used is a placement machine located behind the screen printing machine in the SMT production line.


8. Curing: The function is to melt the patch glue so that the surface mount component is firmly bonded to the PCB board. The equipment used is a curing oven located behind the placement machine in the SMT production line.


9. Reflow soldering: The function is to melt the solder paste so that the surface mount components are firmly bonded to the PCB board. The equipment used was a reflow oven located behind the placement machine in the SMT production line.


10. Cleaning: The function is to remove the harmful welding residues such as flux on the assembled PCB board. The equipment used is a cleaning machine. The location may not be fixed, and it may be online or offline.


11. Detection: The function is to test the quality and assembly quality of the assembled PCB. The equipment used is a magnifying glass, a microscope, an on-line tester (ICT), a flying probe tester, an automatic optical inspection (AOI), an X-ray inspection system, a function tester, and the like. The location can be configured in the right place on the production line according to the need of detection.


12. Rework: The role is to rework the PCB board that failed. The tools used are soldering iron, rework station, etc. Configured anywhere in the production line.

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